Is a final test solution for WLCSP devices needed?

Andy Nagy, Senior Director of Marketing for the Handler Group at Xcerra has recently published on article about final test of WLCSPs in Chip Scale Review. He describes the short-comings of the established test process for WLCSPs particularly with the wider adoption of these package types to critical applications. The article elaborates on a new process, which supports true final test the packages – right before shipment


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