Semiconductor front end automation took place decades ago. The sensitivity of the front end process was requiring it and the always equal form factor of the wafers was supporting it nicely with a standardized transport media, the FOUP (front opening universal pod). It provided a standardized interface for all material handling and processing equipment and the wafer handling is, in general, very reliable and jam free. Automation companies were therefore able to address all technical requirements of the flexible automated material handling between standalone equipment in the fab.
https://blog.xcerra.com/wp-content/uploads/2017/05/iStock-525799810-e1494327997818.jpg 848 909 Andy Nagy https://blog.xcerra.com/wp-content/uploads/2015/08/logo-xcerra1.png Andy Nagy2017-05-23 07:00:252018-07-05 11:00:19Test Floor Automation – is it finally due, after years of talking?