“There is a lot of development in op amps,” said Christopher Lemoine, product marketing director in Xcerra’s ATE group in an interview with Semiconductor Engineering. “There are always higher-performance op amps, lower bias currents, getting closer to the rails, you now have zero-headroom op amps where you can operate right down to the ground rail. At the same time, a lot of the performance hasn’t changed a whole lot.”
blog posts related to semiconductor test
Collision avoidance radar devices generate bursts of RF energy called ‘Chirps’. Which are transmitted (TX) to be reflected and ultimately received (RX). A Chirp is a sinusoid that increases its frequency linearly. The linearly changing frequency of each chirp can be used to extract vector speed information about the target. EBand Radar devices produce chirps over a bandwidth of 1GHz and, as in this example, near 76GHz.
Semiconductor front end automation took place decades ago. The sensitivity of the front end process was requiring it and the always equal form factor of the wafers was supporting it nicely with a standardized transport media, the FOUP (front opening universal pod). It provided a standardized interface for all material handling and processing equipment and the wafer handling is, in general, very reliable and jam free. Automation companies were therefore able to address all technical requirements of the flexible automated material handling between standalone equipment in the fab.
Today the semiconductor test market is very competitive. This is especially true in the consumable contactor market.
Low operating costs and low average selling prices create low barriers to entry. Micro-organizations plants themselves next to their sole customer and provides fast turn times at competitive prices and onsite support. Although this is acceptable for some it is a risky business model. Furthermore the depth of knowledge of the product and therefore the value add from these micro-organizations is limited.
Andreas Bursian, Director InStrip & InMEMS Products, authored an article for Chip Scale Review Magazine, in which he elaborates on the question of what the test requirements for MEMS sensor devices will be in the future. Before he goes into detail, he describes in general what our world will look like in the future shaped by IoT and Industry 4.0., and how this will drive MEMS and sensor technology. Industry 4.0 and IoT are small components of a rapid global change that experts tend to call the 4th Industrial Revolution. This revolution will change all aspects of today’s living, such as cash flow, data handling, job structure, and the political and social structures of society and the industrial production of goods.Download the full article published in Chip Scale Review March 2017
We recently attended the MWC in Barcelona. It is clear 5G is going to happen; it is just not clear on when it will arrive, and what it will actually consist of when it does.
In terms of when, some industry players stated 5G will be earlier than 2020, while others stated later than 2020. Those that ‘want’ it earlier, justified it as ‘the technology that is being used is well understood’; i.e Defense/Mil/Aero have used these technologies, in most cases having either invented or made the technology(ies) viable to manufacture and deploy – albeit in smaller quantities and much higher price points and footprint than what the consumer market for Wireless can support.
OSATs and ATE vendors are making progress in determining what works and what doesn’t in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. Most experts believe that full 3D packaging is at least five years away from mainstream deployment. 2.5D, in contrast, already has made inroads in markets where price sensitivity is low and demand for throughput to memory is extremely high, such as networking, server and graphics applications. Andy Nagy, Senior Director Marketing HG & TCI Operations at Xcerra, recently highlighted the challenges in test handling in an interview with Jeff Dorsch, Semiconductor Engineering. The article compiles thoughts of the key players in this market.
Read the full article here: http://semiengineering.com/2-5d-adds-test-challenges/
Semiconductor giant AMS has set some aggressive growth plans for the coming years. Achieving them will rely on a workforce with a will to win and out-of-the-box thinking.
Sensors are already all around us; they’re used in everything from smartphones to smart homes, to industrial automation and all devices that comprise the Internet of Things (IoT). With new applications constantly being developed, they’re only going to become more pervasive. According to Alexander Everke, Chief Executive at AMS. “Sensor technologies will be increasingly important in the future,” he predicts, adding that they’re replacing the human senses.
Read the full article in the CEO Magazine here: http://www.theceomagazine.com/business/alexander-everke/
Mobile broadband technology is beginning to crawl from commonly known 4th Generation Wireless (4G) transmission standards to fifth generation wireless IMT2020 standardization, also known as 5G. This 5G network technology will influence semiconductor test in two directions, an evolutionary track and a revolutionary paradigm shift. The revolutionary aspect of 5G targets massive amounts of bandwidth not previously thought of as accessible. Many technological challenges have blocked the reasonable implementation of 5G cellular technology. Consumer demand for rapidly growing amounts of bandwidth, has created the need to solve these challenges.
Andy Nagy, Senior Director of Marketing for the Handler Group at Xcerra has recently published on article about final test of WLCSPs in Chip Scale Review. He describes the short-comings of the established test process for WLCSPs particularly with the wider adoption of these package types to critical applications. The article elaborates on a new process, which supports true final test the packages – right before shipment