2.5D Adds Test Challenges: Advanced packaging issues in testing interposers, TSVs

OSATs and ATE vendors are making progress in determining what works and what doesn’t in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. Most experts believe that full 3D packaging is at least five years away from mainstream deployment. 2.5D, in contrast, already has made inroads in markets where price sensitivity is low and demand for throughput to memory is extremely high, such as networking, server and graphics applications. Andy Nagy, Senior Director Marketing HG & TCI Operations at Xcerra, recently highlighted the challenges in test handling in an interview with Jeff Dorsch, Semiconductor Engineering. The article compiles thoughts of the key players in this market.

Read the full article here: http://semiengineering.com/2-5d-adds-test-challenges/

 

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